Novel non-conductive films (NCFs) with multifunctional epoxies and silica fillers for reliable NCFs flip-chip-on organic boards, Proc. of International Conference on Electronic Materials and Packaging, pp.1-7, 2006. ,
Presses polytechniques et universitaires romandes den Besten'92 den Polymer bonding of micro-machined silicon structures, Proc. of MEMS'92, pp.104-109, 1992. ,
Adhesive wafer bonding for MEMS applications, Smart Sensors, Actuators, and MEMS, pp.160-167, 2003. ,
DOI : 10.1117/12.499077
Mesure des ??nergies de rupture interfaciale??: probl??matique et exemples de r??sultats d'essais de gonflement-d??collement, M??canique & Industries, vol.5, issue.4, pp.441-450, 2004. ,
DOI : 10.1051/meca:2004044
<200?????C with polymethylmethacrylate, Applied Physics Letters, vol.65, issue.4, pp.439-441, 1994. ,
DOI : 10.1063/1.112326
Determining the optimal PDMS???PDMS bonding technique for microfluidic devices, Journal of Micromechanics and Microengineering, vol.18, issue.6, p.6, 2008. ,
DOI : 10.1088/0960-1317/18/6/067001
Polyurethane Rubber All-Polymer Artificial Hair Cell Sensor, Journal of Microelectromechanical Systems, vol.15, issue.4, pp.729-736, 2006. ,
DOI : 10.1109/JMEMS.2006.879373
Introduction à la physique des polymères, 2002. ,
Metal based wafer bonding techniques for wafer level packaging, Technical Publication of Süss Microtec Feil, p.3, 2009. ,
Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection, Microsystem Technologies, vol.9, issue.3, pp.176-182, 2003. ,
DOI : 10.1007/s00542-002-0223-5
Low temperature IC-compatible wafer-to-wafer bonding with embedded micro channels for integrated sensing systems, 38th Midwest Symposium on Circuits and Systems. Proceedings, pp.505-508, 1995. ,
DOI : 10.1109/MWSCAS.1995.504487
Effect of Wetting Liquids on the Strength of Adhesion of Viscoelastic Material, The Journal of Adhesion, vol.1, issue.4, pp.281-294, 1972. ,
DOI : 10.1080/00218467208072199
Transfer of micro and nano-photonic silicon nanomembrane waveguide devices on flexible substrates, Optics Express, vol.18, issue.19, pp.1820086-20095, 2010. ,
DOI : 10.1364/OE.18.020086
Design rules for polyimide solvent bonding, Sensors and Materials, vol.11, issue.5, pp.269-278, 1999. ,
Electro???optically tunable microring resonators in lithium niobate, Nature Photonics, vol.92, issue.7, pp.407-410, 2007. ,
DOI : 10.1038/nphoton.2007.93
Etude des mécanismes mis en jeu dans le collage direct du cuivre. Application à l'intégration-3D de circuits, Thèse de doctorat, p.1, 2010. ,
Crack propagation in adhesively bonded steel assemblies, International Journal of Adhesion and Adhesives, vol.21, issue.1, pp.77-83, 2001. ,
DOI : 10.1016/S0143-7496(00)00033-6
Physical model of interface and interphase performance in composite materials and bonded materials, Die Angewandte Makromolekulare Chemie, pp.51-56, 1999. ,
Silicon-wafer fabrication and (potential) applications of direct-bonded silicon, Philips Journal of Research, vol.49, issue.1-2, pp.65-89, 1995. ,
DOI : 10.1016/0165-5817(95)82004-3
A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308), pp.414-418, 2000. ,
DOI : 10.1109/MEMSYS.2000.838553
Thin-film transistors and circuits on plastic foil, 2009 IEEE International Electron Devices Meeting (IEDM), pp.371-374, 2010. ,
DOI : 10.1109/IEDM.2009.5424346
Flexible Ge-on-polyimide detectors, Applied Physics Letters, vol.94, issue.26, pp.941-944, 2009. ,
DOI : 10.1063/1.3167300
Fabrication Techniques for Thin-Film Silicon Layer Transfer, ECS Transactions, pp.67-73, 2006. ,
DOI : 10.1149/1.2357055
Flexible single-crystalline Ge p-channel thin-film transistors with schottky-barrier source/drain on polyimide substrates, IEEE Electron Device Letters, issue.5, pp.31422-424, 2010. ,
Optimization and characterization of wafer-level adhesive bonding with patterned dry-film photoresist for 3D MEMS integration, Sensors and Actuators, pp.137-144, 2010. ,
Low Temperature Nafion Bonding of Silicon Wafers, Electrochemical and Solid-State Letters, vol.2, issue.2, pp.86-87, 1999. ,
DOI : 10.1149/1.1390743
High temperature resistant bonding solutions enabling thin wafer processing (Characterization of polyimide base temporary bonding adhesive for thinned wafer handling), 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), pp.1877-1880, 2010. ,
DOI : 10.1109/ECTC.2010.5490702
Finite width effect of thin-films buckling on compliant substrate: Experimental and theoretical studies, Journal of the Mechanics and Physics of Solids, vol.56, issue.8, pp.2585-2598, 2008. ,
DOI : 10.1016/j.jmps.2008.03.005
Bending effect of Si MOSFETs on flexible plastic substrate, 2008 7th International Caribbean Conference on Devices, Circuits and Systems, pp.1-4, 2008. ,
DOI : 10.1109/ICCDCS.2008.4542621
Hybrid integration of III-V optoelectronic devices on Si platform using BCB, Proc. of SPIE, pp.198-205, 2003. ,
Cleaning solution based on hydrogen peroxide for use in semiconductor technology, RCA Review, vol.31, p.207, 1970. ,
A stretchable form of singlecrystal silicon for high-performance electronics on rubber substrates, Science, issue.208, p.31105, 2006. ,
Characterization of low-temperature wafer bonding using thin-film parylene, Journal of Microelectromechanical Systems, vol.14, issue.6, pp.1347-1355, 2005. ,
DOI : 10.1109/JMEMS.2005.859102
A Novel Low-Temperature Microcap Packaging using SU-8 Bonding, TRANSDUCERS 2007, 2007 International Solid-State Sensors, Actuators and Microsystems Conference, pp.2107-2110, 2007. ,
DOI : 10.1109/SENSOR.2007.4300581
Study of thinned Si wafer warpage in 3D stacked wafers, Microelectronics Reliability, pp.1988-1993, 2010. ,
Wafer-level bonding/stacking technology for 3D integration, Microelectronics Reliability, pp.481-488, 2010. ,
DOI : 10.1016/j.microrel.2009.09.015
Film transfer and bonding techniques for covering single-chip ejector array with microchannels and reservoirs, Journal of Microelectromechanical Systems, vol.14, issue.6, pp.1399-1408, 2005. ,
DOI : 10.1109/JMEMS.2005.859090
An Evaluation Process of Polymeric Adhesive Wafer Bonding for Vertical System Integration, Japanese Journal of Applied Physics, vol.44, issue.6A, pp.443893-3902, 2005. ,
DOI : 10.1143/JJAP.44.3893
Thermal Cycling Effects on Critical Adhesion Energy and Residual Stress in Benzocyclobutene-Bonded Wafers, Journal of The Electrochemical Society, vol.152, issue.4, pp.286-294, 2005. ,
DOI : 10.1149/1.1869252
Critical Adhesion Energy of Benzocyclobutene-Bonded Wafers, Journal of The Electrochemical Society, vol.153, issue.4, pp.347-352, 2006. ,
DOI : 10.1149/1.2172551
Evaluation of BCB Bonded and Thinned Wafer Stacks for Three-Dimensional Integration, Journal of The Electrochemical Society, vol.155, issue.5, pp.280-286, 2008. ,
DOI : 10.1149/1.2844449
Quantitatively controlled nanoliter liquid manipulation using hydrophobic valving and control of surface wettability, Journal of Micromechanics and Microengineering, vol.13, issue.1, pp.89-97, 2003. ,
DOI : 10.1088/0960-1317/13/1/313
Fabrication of microstructured silicon (µs-Si) from a bulk Si wafer and its use in the printing of highperformance thin-film transistors on plastic substrates, J. Micromech. Microeng, vol.20, issue.075018, pp.1-8, 2010. ,
Hybrid Integrated Platforms for Silicon Photonics, Materials, vol.3, issue.3, pp.1782-1802, 2010. ,
DOI : 10.3390/ma3031782
Asymmetric Shielding in Interfacial Fracture Under In-Plane Shear, Journal of Applied Mechanics, vol.59, issue.2, pp.295-304, 1992. ,
DOI : 10.1115/1.2899520
BCB-to-oxide bonding technology for 3D integration, Microelectronics Reliability Liu, 2011. ,
Rapid fabrication of microfluidic chip with three-dimensional structures using natural lotus leaf template, Microfluid Nanofluid Chapitre I : Polymères et collage 42, p.259, 2010. ,
Photo-Polymer Wafer Bonding for Double Layer Transfer, MRS Proceedings, vol.768, p.768, 2003. ,
DOI : 10.1016/S0167-9317(02)00490-2
Si and SiO 2 layer transfer induced by mechanical residual stress, Appl. Phys. Lett, vol.88, pp.1-3, 2006. ,
Evaluation procedures for wafer bonding and thinning of interconnect test structures for 3D ICs, Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695), pp.74-76, 2003. ,
DOI : 10.1109/IITC.2003.1219717
3D integration using adhesive, metal and metal/adhesive as wafer bonding interface, MRS Fall Meeting, pp.1-12, 2008. ,
DOI : 10.1557/proc-1112-e02-01
Reinforcement of a PDMS master using an oxide-coated silicon plate, Microelectronics Journal, vol.37, issue.1, pp.5-11, 2006. ,
DOI : 10.1016/j.mejo.2005.06.012
Will future RFIC be flexible?, Proc. of WAMICON'09, pp.1-5, 2009. ,
DOI : 10.1109/wamicon.2009.5207245
Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI, Journal of Micromechanics and Microengineering, vol.21, issue.8, pp.1-7, 2011. ,
DOI : 10.1088/0960-1317/21/8/085002
Etude de la réalisation de matériau silicium sur isolant (SOI) à partir du collage par adhésion moléculaire silicium sur oxyde (procédé Smart-Cut?, Thèse de doctorat, 1997. ,
Highly sensitive flexible pressure sensors with microstructured rubber dielectric layers, Nature Materials, vol.10, issue.10, pp.859-864, 2010. ,
DOI : 10.1038/nmat2834
Novel technology for hybrid integration of photonic and electronic circuits, IEEE Photonics Technology Letters, vol.8, issue.11, pp.1507-1509, 1996. ,
DOI : 10.1109/68.541565
Fracture mechanics and the adherence of viscoelastic bodies, Journal of Physics D: Applied Physics, vol.11, issue.14, pp.1989-2024, 1978. ,
DOI : 10.1088/0022-3727/11/14/011
Bonding Characterization of Oxidized PDMS Thin Films, MRS Proceedings, vol.1, pp.99-104, 2004. ,
DOI : 10.1021/la981591y
CMP compatibility of partially cured benzocyclobutene (BCB) for a via-first 3D IC process, Mat. Res. Soc. Symp. Proc, vol.867, pp.63-68, 2005. ,
Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimentional (3D) interconnect, IEEE Electronic Components and Technology Conference Proceedings, pp.331-336, 2005. ,
Bonding interfaces in wafer-level metal/adhesive bonded 3D integration, 2008 58th Electronic Components and Technology Conference, pp.871-878, 2008. ,
DOI : 10.1109/ECTC.2008.4550079
Transfer printing by kinetic control of adhesion to an elastomeric stamp, Nature Materials, vol.256, issue.1, pp.33-38, 2006. ,
DOI : 10.1063/1.118988
A printable form of silicon for high performance thin film transistors on plastic substrates, Applied Physics Letters, vol.84, issue.26, p.5, 2004. ,
DOI : 10.1063/1.1767591
Bendable single crystal silicon thin film transistors formed by printing on plastic subtrates, Applied Physics Letters, issue.093507, p.8603, 2005. ,
The bonding energy control: an original way to debondable substrates, ECS Transactions, vol.19, pp.49-56, 2003. ,
Overview of recent direct wafer bonding advances and applications, Advances in Natural Sciences: Nanoscience and Nanotechnology, vol.1, issue.4, p.43004, 2010. ,
DOI : 10.1088/2043-6262/1/4/043004
Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist, 2006 International Conference on MEMS, NANO, and Smart Systems, pp.31-34, 2006. ,
DOI : 10.1109/ICMENS.2006.348211
Void-free full wafer adhesive bonding, Proc. of Int. MEMS. Conf, pp.247-252, 2000. ,
DOI : 10.1109/memsys.2000.838524
Low-temperature full wafer adhesive bonding, Journal of Micromechanics and Microengineering, vol.11, issue.2, pp.100-107, 2001. ,
DOI : 10.1088/0960-1317/11/2/303
Adhesive wafer bonding for microelectronic and microelectromechanical systems, Thèse de doctorat, Royal Institute of Technology Chapitre I : Polymères et collage 43, p.259, 2002. ,
Adhesive wafer bonding, J. Appl. Phys, pp.991-1019, 2006. ,
Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration, Journal of The Electrochemical Society, vol.153, issue.4, pp.291-295, 2006. ,
DOI : 10.1149/1.2168409
Parylene gas chromatographic column for rapid thermal thermal cycling, Journal of Microelectromechanical Systems, vol.11, issue.6, pp.718-725, 2002. ,
Wafer bonding using microwave heating of parylene intermediate layers, Journal of Micromechanics and Microengineering, vol.14, issue.4, pp.625-631, 2004. ,
DOI : 10.1088/0960-1317/14/4/025
Selective wafer level adhesive bonding with benzocyclobutene, Proc. of MME 2001, pp.54-57, 2001. ,
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities, Sensors and Actuators A: Physical, vol.105, issue.3, pp.297-304, 2003. ,
DOI : 10.1016/S0924-4247(03)00202-4
BCB contact printing for patterned adhesive full-wafer bonded 0-level packages, Journal of Microelectromechanical Systems, vol.14, issue.2, pp.419-425, 2005. ,
DOI : 10.1109/JMEMS.2004.839030
A low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems, Journal of Micromechanics and Microengineering, vol.12, issue.2, p.2, 2002. ,
DOI : 10.1088/0960-1317/12/2/313
A low-temperature wafer bonding technique using patternable materials, Journal of Micromechanics and Microengineering, vol.12, issue.5, pp.611-615, 2002. ,
DOI : 10.1088/0960-1317/12/5/315
Intermediate wafer level bonding and interface behaviour, Microelectronics Reliability, pp.657-663, 2005. ,
DOI : 10.1016/j.microrel.2004.10.019
A novel metal-protected plasma treatment for the robust bonding of polydimethylsiloxane, Lab on a Chip, vol.82, issue.12, pp.1813-1818, 2007. ,
DOI : 10.1039/b709761a
Ion-sliced lithium niobate thin films for active photonic devices, Optical Materials, vol.31, issue.7, pp.1054-1058, 2009. ,
DOI : 10.1016/j.optmat.2007.12.019
Localized Parylene-C bonding with reactive multilayer foils, Journal of Physics D: Applied Physics, vol.42, issue.18, p.4299, 2009. ,
DOI : 10.1088/0022-3727/42/18/185411
Etude du collage par adhésion moléculaire hydrophile : application a contrôle de l'énergie de collage, Thèse de doctorat, p.6, 1999. ,
Rough Surface Adhesion Mechanisms for Wafer Bonding, ECS Transactions, pp.205-215, 2006. ,
DOI : 10.1149/1.2357071
Ultra-thin benzocyclobutene (BCB) bonding of III-V dies onto an SOI substrate Adhesive bonding of III-V dies to processed SOI using BCB for photonic applications, Proc. of 210 th meeting of ECS, pp.321-326, 2005. ,
Adhesive Bonding of InP???InGaAsP Dies to Processed Silicon-On-Insulator Wafers using DVS-bis-Benzocyclobutene, Journal of The Electrochemical Society, vol.153, issue.12, pp.1015-1019, 2006. ,
DOI : 10.1149/1.2352045
III- V/silicon photonics for on-chip and intra-chip optical interconnects, Laser & Photon, pp.1-29, 2010. ,
Materials and Mechanics for Stretchable Electronics, Science, vol.327, issue.5973, pp.1603-1607, 2010. ,
DOI : 10.1126/science.1182383
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.455.4028
Atomic diffusion bonding of wafers with thin nanocrystalline metal films, Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, vol.28, issue.4, pp.706-714, 2010. ,
DOI : 10.1116/1.3437515
Wafer bonding with intermediate parylene layer, Proc. of International Conference on Solid-State and Integrated-Circuit Technology Shull, 2008. ,
Deformation behavior of thin, compliant layers under tensile loading conditions, Journal of Polymer Science Part B: Polymer Physics, vol.67, issue.22, pp.4023-4043, 2004. ,
DOI : 10.1002/polb.20258
Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias, Microelectronic Engineering, vol.87, issue.3, pp.510-513, 2010. ,
DOI : 10.1016/j.mee.2009.06.029
Direct bonding of organic polymeric materials, Philips Journal of Research, vol.49, issue.1-2, pp.139-149, 1995. ,
DOI : 10.1016/0165-5817(95)82007-8
A Model for the Silicon Wafer Bonding Process, Japanese Journal of Applied Physics, vol.28, issue.Part 1, No. 10, pp.1735-1741, 1989. ,
DOI : 10.1143/JJAP.28.1735
Inorganic Semiconductors for Flexible Electronics, Advanced Materials, vol.89, issue.340, pp.1897-1916, 2007. ,
DOI : 10.1002/adma.200602223
Asymmetric Shielding Mechanisms in the Mixed-Mode Fracture of a Glass/Epoxy Interface, Journal of Applied Mechanics, vol.65, issue.1, pp.25-29, 1998. ,
DOI : 10.1115/1.2789035
An ultra-thin PDMS membrane as a bio/micro???nano interface: fabrication and characterization, Biomedical Microdevices, vol.845, issue.20, pp.587-595, 2007. ,
DOI : 10.1007/s10544-007-9070-6
Semiconductor wafer bonding: science and technology Characterization of anodic bonding, Thèse de doctorat, Massachusetts Institute of Technology Ventosa'08, 1999. ,
Hydrophilic low temperature direct wafer bonding Mechanism of thermal silicon oxide direct wafer bonding, J. Appl. Phys. Electrochem. Solid State Lett, vol.104, issue.1210, pp.373-375, 2008. ,
Mécanismes mis en jeu dans le collage direct de surfaces hydrophiles, Thèse de doctorat, p.2, 2009. ,
Interfacial toughness measurements for thin films on substrates, Acta Materialia, vol.50, issue.3, pp.441-466, 2002. ,
DOI : 10.1016/S1359-6454(01)00354-8
Field Assisted Glass???Metal Sealing, Journal of Applied Physics, vol.40, issue.10, pp.3946-3949, 1969. ,
DOI : 10.1063/1.1657121
Field Assisted Glass Sealing, ElectroComponent Science and Technology, vol.2, issue.1, pp.45-53, 1975. ,
DOI : 10.1155/APEC.2.45
URL : https://doaj.org/article/fc888d79d4a646debdbe72bd114488e8
The Temperature Dependence of Relaxation Mechanisms in Amorphous Polymers and Other Glass-forming Liquids, Journal of the American Chemical Society, vol.77, issue.14, pp.3701-3707, 1955. ,
DOI : 10.1021/ja01619a008
Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature, Sensors and Actuators A: Physical, vol.43, issue.1-3, pp.223-229, 1994. ,
DOI : 10.1016/0924-4247(93)00653-L
URL : http://deepblue.lib.umich.edu/bitstream/2027.42/31608/1/0000537.pdf
Ultrathin silicon solar microcells for semitransparent, mechanically flexible and??microconcentrator module designs, Nature Materials, vol.82, issue.11, pp.907-915, 2008. ,
DOI : 10.1038/nmat2287
Microwave thin-film transistors using Si nanomembranes on flexible polymer substrate, Applied Physics Letters, vol.89, issue.21, p.8909, 2006. ,
DOI : 10.1063/1.2397038
Flexible photodetectors on plastic substrates by use of printing transferred singlecrystal germanium membranes, Appl. Phys. Lett, issue.10, p.94, 2009. ,
A low temperature ultrasonic bonding method for PMMA microfluidic chips, Microsystem Technologies, vol.24, issue.4, pp.533-541, 2010. ,
DOI : 10.1007/s00542-010-1027-7
Spin on dopants for high-performance single-crystal silicon transistors on flexible plastic substrates, Applied Physics Letters, vol.86, issue.13, p.86, 2005. ,
DOI : 10.1063/1.1894611
Fabrication of large-scale mono-crystalline silicon micro-mirror arrays using adhesive wafer transfer bonding, Proc. of SPIE, pp.1-9, 2010. ,
Mechanically flexible thin-film transistors that use ultrthin ribbons of silicon derived from bulk wafers, Appl. Phys. Lett, p.8806, 2006. ,
Transfer printing by kinetic control of adhesion to an elastomeric stamp, Nature Materials, vol.256, issue.1, pp.33-38, 2006. ,
DOI : 10.1063/1.118988
Bendable single crystal silicon thin film transistors formed by printing on plastic subtrates, Applied Physics Letters, issue.093507, p.8684, 2005. ,
Precise determination of lattice parameter and thermal expansion coefficient of silicon between 300 and 1500 K, Journal of Applied Physics, vol.56, issue.2, pp.314-320, 1984. ,
DOI : 10.1063/1.333965
Controlled wavelength reduction in surface wrinkling of poly(dimethylsiloxane), Soft Matter, vol.60, issue.3, pp.677-684, 2010. ,
DOI : 10.1039/B916603C
Grinding induced subsurface cracks in silicon wafers, International Journal of Machine Tools and Manufacture, vol.39, issue.7, pp.1103-1116, 1999. ,
DOI : 10.1016/S0890-6955(98)00079-0
Fine grinding of silicon wafers, International Journal of Machine Tools and Manufacture, vol.41, issue.5, pp.659-672, 2001. ,
DOI : 10.1016/S0890-6955(00)00101-2
Materials and Mechanics for Stretchable Electronics, Science, vol.327, issue.5973, pp.1603-1607, 2010. ,
DOI : 10.1126/science.1182383
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.455.4028
The mechanism of anisotropic silicon etching and its relevance for micromachining, Proc. of Transducers, pp.120-125, 1987. ,
Anisotropic Etching of Crystalline Silicon in Alkaline Solutions, Journal of The Electrochemical Society, vol.137, issue.11, pp.3612-3626, 1990. ,
DOI : 10.1149/1.2086277
Single Crystal Silicon Thin Film on Polymer Substrate by Double Layer Transfer Method, ECS Transactions, vol.35, issue.5, pp.123-128, 2011. ,
DOI : 10.1149/1.3570786
Comparison of anisotropic etching properties between KOH and TMAH solutions, Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291), pp.315-320, 1999. ,
DOI : 10.1109/MEMSYS.1999.746845
Inorganic Semiconductors for Flexible Electronics, Advanced Materials, vol.89, issue.340, pp.1897-1916, 2007. ,
DOI : 10.1002/adma.200602223
Theory of Elasticity, p.8, 1934. ,
Accurate characterization of wafer bond toughness with the double cantilever specimen, Journal of Applied Physics, vol.103, issue.1, pp.1-7, 2008. ,
DOI : 10.1063/1.2828156
Epitaxial layer transfer by bond and etch back of porous Si, Applied Physics Letters, vol.64, issue.16, pp.2108-2110, 1994. ,
DOI : 10.1063/1.111698
ELTRAN® ; Novel SOI wafer technology, JSAP International, vol.4, pp.10-16, 2001. ,
DOI : 10.1007/978-94-010-0339-1_5
Ultrathin silicon solar microcells for semitransparent, mechanically flexible and??microconcentrator module designs, Nature Materials, vol.82, issue.11, pp.907-915, 2008. ,
DOI : 10.1038/nmat2287
Microwave thin-film transistors using Si nanomembranes on flexible polymer substrate, Applied Physics Letters, vol.89, issue.21, p.8907, 2006. ,
DOI : 10.1063/1.2397038
Microstructure studies of the grinding damage in monocrystalline silicon wafers, Rare Materials, vol.26, issue.1, pp.13-18, 2007. ,
Spin on dopants for high-performance single-crystal silicon transistors on flexible plastic substrates, Applied Physics Letters, vol.86, issue.13, p.86259, 2005. ,
DOI : 10.1063/1.1894611
CEA-Léti / CNRS) Procédé de réalisation d'une couche mince de silicium monocristallin sur une couche de polymère, p.105496901, 2010. ,
The generic nature of the Smart-Cut?? process for thin film transfer, Journal of Electronic Materials, vol.2, issue.268, pp.30834-840, 2001. ,
DOI : 10.1007/s11664-001-0067-2
Procédé de fabrication de films minces de matériau semiconducteur, p.911149195, 1991. ,
Silicon on insulator material technology, Electronics Letters, vol.31, issue.14, pp.311201-1202, 1995. ,
DOI : 10.1049/el:19950805
Double-flip transfer of indium phosphide layers via adhesive wafer bonding and ion-cutting process, Applied Physics Letters, vol.90, issue.5, pp.901-904, 2007. ,
DOI : 10.1063/1.2450665
Integration of thin layers of single-crystalline InP with flexible substrates, Applied Physics Letters, vol.92, issue.21, pp.92-212109, 2008. ,
DOI : 10.1063/1.2937409
Silicon layer transfer using wafer bonding and debonding, Journal of Electronic Materials, vol.35, issue.7, pp.841-844, 2001. ,
DOI : 10.1007/s11664-001-0068-1
Effect of pressure and stress on blistering induced by hydrogen implantation in silicon, EPL (Europhysics Letters), vol.92, issue.1, pp.921-926, 2010. ,
DOI : 10.1209/0295-5075/92/16001
Hardness and fracture toughness of semiconducting materials studied by indentation and erosion techniques, Materials Science and Engineering: A, vol.105, issue.106, pp.105-106131, 1988. ,
DOI : 10.1016/0025-5416(88)90489-2
Mechanics of Smart-Cut?? technology, International Journal of Solids and Structures, vol.41, issue.16-17, pp.4299-4320, 2004. ,
DOI : 10.1016/j.ijsolstr.2004.02.054
Measurement of the mechanical properties of thin films mechanically confined within contacts, Tribology Letters, pp.245-252, 2006. ,
Evolution thermique des défauts introduits par implantation ionique d'hydrogène ou d'hélium dans le silicium et le carbure de silicium, Thèse de doctorat, p.7, 2000. ,
Electro???optically tunable microring resonators in lithium niobate, Nature Photonics, vol.92, issue.7, pp.407-410, 2007. ,
DOI : 10.1038/nphoton.2007.93
Flexible Ge-on-polyimide detectors, Applied Physics Letters, vol.94, issue.26, p.9402, 2009. ,
DOI : 10.1063/1.3167300
Physical mechanisms behind the ion-cut in hydrogen implanted silicon, Journal of Applied Physics, vol.92, issue.5, pp.2335-2342, 2002. ,
DOI : 10.1063/1.1494844
Fabrication Techniques for Thin-Film Silicon Layer Transfer, ECS Transactions, pp.67-73, 2006. ,
DOI : 10.1149/1.2357055
Flexible single-crystalline Ge p-channel thin-film transistors with schottky-barrier source/drain on polyimide substrates, IEEE Electron Device Letters, issue.5, pp.31422-424, 2010. ,
Onset of blistering in hydrogen-implanted silicon, Applied Physics Letters, vol.74, issue.7, pp.74982-984, 1999. ,
DOI : 10.1063/1.123430
C.M.O.S. devices fabricated on buried SiO2 layers formed by oxygen implantation into silicon, ) C.M.O.S. devices fabricated on buried SiO 2 layers formed by oxygen implantation into silicon, pp.593-594, 1978. ,
DOI : 10.1049/el:19780397
Etude de la fracture impliquée dans le procédé Smart-Cut ® : application a matériaux SOI, Thèse de doctorat, p.85, 2000. ,
Wafer bonding for silicon???on???insulator technologies, Applied Physics Letters, vol.48, issue.1, p.48, 1985. ,
DOI : 10.1063/1.96768
Fabrication of single-crystalline LiTaO[sub 3] film on silicon substrate using thin film transfer technology, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.26, issue.1, pp.26206-208, 2008. ,
DOI : 10.1116/1.2830691
CEA-Léti), Procédé d'obtention d'une couche très mince par amincissement par auto-portage provoqué, p.350207, 2003. ,
CEA-Léti) Fabrication d'une structure souple par transfert de couches, p.1162086, 2011. ,
Transfert de couches monocristallines sur polymère par implantation ionique et fracture 204, p.259 ,
The bulk modulus and Poisson's ratio of ???incompressible??? materials, Journal of Sound and Vibration, vol.312, issue.4-5, pp.572-575, 2008. ,
DOI : 10.1016/j.jsv.2008.01.026
Transfert de couches minces de LiTaO 3 et LiNbO 3 par application de la technologie Smart Cut TM, Thèse de doctorat, p.92, 2010. ,
An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, Journal of Materials Research, vol.XI, issue.06, pp.1564-1583, 1992. ,
DOI : 10.1557/JMR.1992.0613
Integration of Single-Crystal LiNbO3 Thin Film on Silicon by Laser Irradiation and Ion Implantation??? Induced Layer Transfer, Advanced Materials, vol.76, issue.12, pp.1533-1536, 2006. ,
DOI : 10.1002/adma.200502364
Fragilisation et dynamique de la rupture du silicium implanté, Thèse de doctorat, p.8, 2010. ,
Impact of the transient formation of molecular hydrogen on the microcrack nucleation and evolution in H-implanted Si (001), Journal of Applied Physics, vol.103, issue.2, pp.1-9, 2008. ,
DOI : 10.1063/1.2829807
Ion-sliced lithium niobate thin films for active photonic devices, Optical Materials, vol.31, issue.7, pp.1054-1058, 2009. ,
DOI : 10.1016/j.optmat.2007.12.019
Competing failure mechanisms in thin films: Application to layer transfer, Journal of Applied Physics, vol.105, issue.7, pp.1-9, 2009. ,
DOI : 10.1063/1.3078801
Optical and electro-optical properties of submicrometer lithium niobate slab waveguides prepared by crystal ion slicing and wafer bonding, Applied Physics Letters, vol.85, issue.20, p.8507, 2004. ,
DOI : 10.1063/1.1819527
A procedure to prevent pile up effects on the analysis of spherical indentation data in elastic???plastic materials, Mechanics of Materials, vol.39, issue.11, pp.987-997, 2007. ,
DOI : 10.1016/j.mechmat.2007.04.003
CEA-Léti) Procédé et dispositif de suivi d'un traitement thermique d'un substrat microtechnologique, p.605620, 2006. ,
The Phenomenology of Ion Implantation-Induced Blistering and Thin-Layer Splitting in Compound Semiconductors, Journal of Electronic Materials, vol.12, issue.10, pp.392177-2189, 2010. ,
DOI : 10.1007/s11664-010-1334-x
The Distribution of Stress in the Neighbourhood of a Crack in an Elastic Solid, Proc. R. Lond. A, pp.229-260, 1009. ,
DOI : 10.1098/rspa.1946.0077
Photonic crystal structures in ion-sliced lithium niobate thin films, Optics Express, vol.17, issue.22, pp.20291-20300, 2009. ,
DOI : 10.1364/OE.17.020291
Présentation interne CEA-Léti Tauzin'08b) 3-inch single-crystal LiTaO 3 films onto metallic electrode using Smart Cut TM technology, 08a Tauzin A. Electronics Letters, issue.13, p.4407, 2008. ,
Hydrogen blistering of silicon: Progress in fundamental understanding, physica status solidi (a), vol.249, issue.377, pp.2129-2184, 2007. ,
DOI : 10.1002/pssa.200622520
Layer splitting process in hydrogen-implanted Si, Ge, SiC, and diamond substrates, Applied Physics Letters, vol.70, issue.11, pp.701390-1392, 1997. ,
DOI : 10.1063/1.118586
A ???smarter-cut??? approach to low temperature silicon layer transfer, Applied Physics Letters, vol.72, issue.1, pp.49-51, 1998. ,
DOI : 10.1063/1.120601
Hydrogen-imlant induced exfoliation of silicon and other crystals, Appl. Phys. Lett, issue.24, pp.713519-3521, 1997. ,
Films by Oxygen-Ion Bombardment, Japanese Journal of Applied Physics, vol.5, issue.8, pp.737-738, 1966. ,
DOI : 10.1143/JJAP.5.737
Hydrophilization and hydrophobic recovery of PDMS by oxygen plasma and chemical treatment???An SEM investigation, Sensors and Actuators B: Chemical, vol.123, issue.1, pp.368-373, 2006. ,
DOI : 10.1016/j.snb.2006.08.037
Spontaneous formation of complex and ordered structures on oxygen-plasma-treated elastomeric polydimethylsiloxane, Applied Physics Letters, vol.76, issue.6, pp.76721-724, 2000. ,
DOI : 10.1063/1.125873
Transformation of Poly(dimethylsiloxane) into thin surface films of SiO x by UV/Ozone treatment. Part I: Factors affecting modification, Journal of Materials Science, vol.39, issue.535, pp.6362-6373, 2006. ,
DOI : 10.1007/s10853-006-0712-5
Silicon in mechanical sensors, Journal of Physics E: Scientific Instruments, vol.21, issue.12, pp.1114-1128, 1988. ,
DOI : 10.1088/0022-3735/21/12/001
Crosslinked polydimethylsiloxane exposed to oxygen plasma studied by neutron reflectometry and other surface specific techniques, Polymer, vol.41, issue.18, pp.416851-6863, 2000. ,
DOI : 10.1016/S0032-3861(00)00039-2
Flexible polysilicon sensor array modules using ???etch-release??? packaging scheme, Sensors and Actuators A: Physical, vol.111, issue.1, pp.135-141, 2004. ,
DOI : 10.1016/j.sna.2003.10.022
Novel 3D force sensor using ultra-thin silicon strain gauge bonded on metal membrane, TRANSDUCERS 2009, 2009 International Solid-State Sensors, Actuators and Microsystems Conference, pp.1920-1923, 2009. ,
DOI : 10.1109/SENSOR.2009.5285694
Wafer bonding for silicon???on???insulator technologies, Applied Physics Letters, vol.48, issue.1, p.48, 1985. ,
DOI : 10.1063/1.96768
Solvent Compatibility of Poly(dimethylsiloxane)-Based Microfluidic Devices, Analytical Chemistry, vol.75, issue.23, p.65446554, 2003. ,
DOI : 10.1021/ac0346712
Flexible and tactile sensor based on a photosensitive polymer, Microelectronic Engineering, pp.87-14001403, 2010. ,
DOI : 10.1016/j.mee.2009.11.161
Polymer-based selfstanding flexible strain sensor, Journal of Sensors, p.659571, 2010. ,
Characterization of Polydimethylsiloxane (PDMS) Properties for Biomedical Micro/Nanosystems, Biomedical Microdevices, vol.56, issue.535, pp.281-293, 2005. ,
DOI : 10.1007/s10544-005-6070-2
Transformation of poly(dimethylsiloxane) into thin surface films of SiO x by UV/ozone treatment. Part II: segregation and modification of doped polymer blends, Journal of Materials Science, vol.15, issue.12, pp.6374-6384, 2006. ,
DOI : 10.1007/s10853-006-0713-4
CEA-Léti) Procédé de réalisation d'un film monocristallin sur un support en polymère, p.0, 2011. ,
Conversion of Some Siloxane Polymers to Silicon Oxide by UV/Ozone Photochemical Processes, Chemistry of Materials, vol.12, issue.6, pp.1591-1596, 2000. ,
DOI : 10.1021/cm990770d
Controlled wavelength reduction in surface wrinkling of poly(dimethylsiloxane), Soft Matter, vol.60, issue.3, pp.677-684, 2010. ,
DOI : 10.1039/B916603C
Etude de faisabilité de capteurs de pression piézorésistifs à jauges en silicium polycristallin, p.2, 1992. ,
Polymer-based stress sensor with integrated readout, Journal of Physics D: Applied Physics, vol.35, issue.21, pp.2698-2703, 2002. ,
DOI : 10.1088/0022-3727/35/21/302
or Ar Plasmas for Controlling Surface Wetting Properties and Their Ageing, Japanese Journal of Applied Physics, vol.46, issue.2, pp.744-750, 2007. ,
DOI : 10.1143/JJAP.46.744
Parylene-Based Strain Sensors for Bone, IEEE Sensors Journal, vol.7, issue.12, pp.1693-1697259, 2007. ,
DOI : 10.1109/JSEN.2007.909923