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            <title xml:lang="en">Dynamic characterization of the wetting and drying states of DTI (Deep Trench Isolation) structures using high frequency ultrasonic waves</title>
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                <title xml:lang="en">Dynamic characterization of the wetting and drying states of DTI (Deep Trench Isolation) structures using high frequency ultrasonic waves</title>
                <title xml:lang="fr">Caractérisation dynamique de l'état de mouillage et de séchage de structures DTI(Deep Trench Isolation) par ondes ultrasonores haute fréquence</title>
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                <authority type="supervisor">Julien Carlier</authority>
                <authority type="supervisor">Vincent Thomy</authority>
                <authority type="supervisor">Pierre Campistron</authority>
                <authority type="supervisor">Marc Neyens</authority>
                <authority type="jury">Emmanuel Le Clézio [Président]</authority>
                <authority type="jury">Corinne Déjous [Rapporteur]</authority>
                <authority type="jury">Raluca Tiron</authority>
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                <term xml:lang="en">Acoustics</term>
                <term xml:lang="en">Deep Trench Isolation</term>
                <term xml:lang="en">Microfluidics</term>
                <term xml:lang="en">Nondestructive testing</term>
                <term xml:lang="en">Microelectronics</term>
                <term xml:lang="en">Surface cleaning</term>
                <term xml:lang="en">Wetting</term>
                <term xml:lang="en">Micro and Nano-technology</term>
                <term xml:lang="en">Piezoelectric transducers</term>
                <term xml:lang="fr">Micro et Nano-technologie</term>
                <term xml:lang="fr">Mouillage</term>
                <term xml:lang="fr">Nettoyage de surface</term>
                <term xml:lang="fr">Microélectronique</term>
                <term xml:lang="fr">Contrôles non destructifs</term>
                <term xml:lang="fr">Acoustique</term>
                <term xml:lang="fr">Transducteurs piézoélectriques</term>
                <term xml:lang="fr">Microfluidique</term>
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              <p>In the semiconductor industry, effective wet cleaning of contamination is a critical factor in ensuring good quality of electronic products. The cycle between the wetting and drying processes can create several problems in the high aspect ratio micro / nanoscale structures. In this thesis work, we present the characterization of the dynamic wetting of fluids within Deep Trench Isolation (DTI) structures used in STMicroelectronics imaging sensors. This characterization uses an original technique of acoustic waves reflectometry at ultra-high frequencies. In order to obtain cleaning conditions as close as possible to those used in the industrial process, dynamic wetting is provided by a microfluidic channel made of PolyDiMethylSiloxane (PDMS) located at the level of the structures to be studied. An analytical numerical model based on 2D finite difference allowed us to simulate the acoustic interactions inside micro / nanostructures to better interpret the experimental results. In addition, the development of a technique for the automatic acquisition of the acoustic reflection coefficient has made it possible to study the rapid wetting processes of DTI structures. Finally, the kinematics of DTI drying was also studied with different liquids. Structural deformation phenomenon, known as "pattern collapse", was analyzed using scanning electron microscopy (SEM) images and correlated with acoustic measurements.</p>
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              <p>Dans l'industrie des semi-conducteurs, un nettoyage efficace des contaminations par voie humide est un facteur déterminant pour garantir la bonne qualité des produits électroniques. Le cycle entre les processus de mouillage et de séchage peut alors créer plusieurs problèmes dans les structures micro/nanométriques à rapport d'aspect élevé. Dans ce travail de thèse, nous présentons la caractérisation due mouillage dynamique de fluides au sein de structures "Deep Trench Isolation" (DTI) utilisés dans les capteurs imageurs de STMicroelectronics. Cette caractérisation utilise une technique originale de réflectométrie d'ondes acoustiques à ultra-hautes fréquences. Afin d'obtenir des conditions de nettoyage aussi proches que possible de celles utilisées dans le procédé industriel, le mouillage dynamique est assuré par un canal microfluidique réalisé en PolyDiMethylSiloxane (PDMS) localisé au niveau des structures à étudier. Un modèle numérique analytique basé sur les différences finies 2D nous a permis de simuler les interactions acoustiques à l'intérieur des micro/nanostructures pour interpréter au mieux les résultats expérimentaux. De plus, le développement d'une technique d'acquisition automatique du coefficient de réflexion acoustique a donné la possibilité d‟étudier les processus rapides de mouillage des structures DTI. Enfin, la cinématique de séchage des DTI a également été étudiée avec différents liquides. Des phénomènes de déformation des structures ("pattern collapse") ont été analysés à l'aide d'images de microscopie électronique à balayage (MEB) et corrélés avec les mesures acoustiques.</p>
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