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Matériaux d'assemblage basse température pour applications électroniques : de l'intérêt des oxalates et formiates de métaux

Abstract : Due to environmental and health concerns, new regulations led to a restriction in the use of lead in electronic equipment. Joining materials (based on tin, silver, copper, bismuth ...) for surface-mount technology are subject to many development work in order to comply with regulatory and technical requirements. The potential of metal carboxylates in electronics has already been demonstrated in the development of metal-organic decomposition processes. The thermal decomposition under controlled atmosphere of such precursors leads to the creation of metal nanoparticles with an increased reactivity compared to that of micron sized particles. The use of nanomaterials is a seriously considered way for developing low temperature joining processes for electronics. It is based on the well-known decrease of melting and sintering temperatures of nanomaterials with particle size. In this context, this work of thesis presents the study of the controlled decomposition of metal-organic precursors intended to be integrated into a low-temperature lead-free joining process. The thermal behavior of several metal-organic precursors of tin and bismuth, as well as the influence of the decomposition atmosphere, were studied. The relationship between the metal particles size and their melting point has been emphasized, as well as the major influence of oxidation on the evolution of particles size and their ability to make reliable joints.
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  • HAL Id : tel-02407359, version 1

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Pierre Roumanille. Matériaux d'assemblage basse température pour applications électroniques : de l'intérêt des oxalates et formiates de métaux. Matériaux. Université Paul Sabatier - Toulouse III, 2018. Français. ⟨NNT : 2018TOU30106⟩. ⟨tel-02407359⟩

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